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SPI Solder Paste Inspection



JET-6300 3D SPI system provides an ideal solution to the inspection of solder paste by balancing capability and cost effectiveness. The latest dual projection design enables the JET -6300 to effectively eliminate the risk of shadowing and the problems with specular reflection. With the highly accurate linear motor and the high resolution 3D camera, solder paste volume and height can be checked easily and the inspection speed can be up to 80cm2/sec at 10x10 um resolution. The easy programming , friendly user interface and automatic compensation for board warp make the operation more convenient and help improve manufacturing yield.
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