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The truth is that high complexity PCBs with tiny components is a tendency. To
follow such trend, Jet Technology launch JET-6000,
a sophisticated and powerful solder paste inspection tester to check all the printing
defects. It adopts RGB Tri-linear CCD which incorporated with 3-phases shifting
algorithm for 3D profile measurement of solder paste. In addition, SPC reports
provide sufficient information for printing process control. ¡@Features¡@
- Meet the most demanding
cycle time requirements with 100% inspection
-
Precise inspection by 3-phases shifting algorithm for height, area, volume, shift
and bridging measurement of solder paste
- Easy
and fast to recognize fiducial mark and program by teaching with partial Gerber
file
- Easy to
analyze defective pads by trend charts and numeric display
- Display
overall trend of measurement results with color diagram to be feedback information
for optimizing the screen printing.
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Good repeatability and reproducibility (GR&R <10%)
- Accurately
inspection of all components with good repeatability for CSP with pads size as
small as 8 mils
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In time inspection data of height, area, volume and shrifts of solder paste. |
Statistic
Process Control | ¡@Specification¡@
| Dimensions
(h x w x d) | 216
x 100 x 137 cm (78 x 39 x 54 in) | | Machine
weight | 1200
kg (2600 lbs) | | Electric
power | AC 220~240
V, 50/60 Hz, 15 amps. | | Air
pressure | 5
~ 7 kgf/cm2 (70 ~ 100 psi) | | Conveyor
speed (Left to Right or Right to Left) | 300
mm/sec (12 in/sec) | | Conveyor
height (adjustable) | 890
~ 965mm (35 ~ 38 in) | | Maximum
inspection area | 500
x 450 mm (15 x 16 in) | | Minimum
inspection area | 100
x 70 mm (4 x 2.75 in) | | Board
thickness range | 0.5
~ 5.0 mm (0.02 ~ 0.2 in) | | Board
edge clearance | top
2.5 mm (0.1 in) ,
bottom 3.8 mm (0.2 in) | |
¡@Features¡@
| Typical
inspection speeds | 64
cm2/sec (9.94 in2/sec) | | Typical
fiducial mark finding | <
4 seconds | | X
and Y pixel resolution | 20
microns (0.788 mils) | | Z
axis (height) resolution | 1.225
microns (0.048 mils) | | Permitted
maximum board warp | <
2mm for each scan width 42 mm | | Paste
height range | 50
~ 450 micros (2~18 mils) | | Height
Repeatability (3 sigma limit) | CSP
: 5 microns( 8 to 18 mils in diameter)
BGA & QFP : 3
microns( ¡Ù 20 mils in diameter) | | Height
Repeatability (3 sigma limit) | CSP
: ¡Ó 7 %( 8 to 18 mils in diameter)
BGA & QFP :
¡Ó 3 %( ¡Ù 20 mils in diameter) | | Height
Accuracy | CSP
: 8 microns( 8 to 18 mils in diameter)
BGA & QFP : 5
microns( ¡Ù 20 mils in diameter) | | ¡@Dimension¡@
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